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KOMDIV-32

FieldValue
nameKOMDIV-32
produced-start
slowest33
fastest125
slow-unitMHz
fast-unitMHz
size-from0.25 μm
size-to0.5 μm
designfirmNIISI
manuf1NIISI
manuf2Mikron
manuf3MVC Nizhny Novgorod
archMIPS I
numcores1

| produced-start = | produced-end = | slow-unit = MHz | fast-unit = MHz | fsb-slowest = | fsb-fastest = | fsb-slow-unit = | fsb-fast-unit = | size-from = 0.25 μm | size-to = 0.5 μm The KOMDIV-32 () is a family of 32-bit microprocessors developed and manufactured by the Scientific Research Institute of System Development (NIISI) of the Russian Academy of Sciences. The manufacturing plant of NIISI is located in Dubna on the grounds of the Kurchatov Institute. The KOMDIV-32 processors are intended primarily for spacecraft applications and many of them are radiation hardened (rad-hard).

These microprocessors are compatible with MIPS R3000 and have an integrated MIPS R3010 compatible floating-point unit.

Overview

DesignationProduction start (year)Process (nm)Clock rate (MHz)RemarksRussianEnglish
1В8121V812?50033
1890ВМ1Т1890VM1T200050050rad-hard
1890ВМ2Т1890VM2T200335090
1990ВМ2Т1990VM2T2008 ?35066rad-hard
5890ВМ1Т5890VM1Т200950033rad-hard
5890ВЕ1Т5890VE1Т200950033rad-hard
1900ВМ2Т1900VM2T201235066rad-hard
1904ВЕ1Т1904VE1T201635040
1907ВМ0141907VM0142016250100rad-hard
1907ВМ0381907VM0382016 ?250125rad-hard
1907ВМ0441907VM0442016 ?25066rad-hard
1907ВМ0561907VM0562016 ?250100rad-hard
1907ВМ0661907VM0662016 ?250100rad-hard
1907ВК0161907VK016?250100rad-hard

Details

1V812

  • 0.5 μm CMOS process, 3-layer metal
  • 108-pin ceramic quad flat package (QFP)
  • 1.5 million transistors, 8KB L1 instruction cache, 8KB L1 data cache, compatible with IDT 79R3081E

1890VM1T

  • 0.5 μm CMOS process

1890VM2T

  • 0.35 μm CMOS process

1990VM2T

  • 0.35 μm silicon on insulator (SOI) CMOS process
  • 108-pin ceramic Quad Flat Package (QFP)
  • working temperature from -60 to 125 °C

5890VM1Т

  • 0.5 μm silicon on insulator (SOI) CMOS process
  • 108-pin ceramic quad flat package (QFP)
  • cache (8KB each for data and instructions)
  • working temperature from -60 to 125 °C

5890VE1Т

  • 0.5 μm SOI CMOS process
  • 240-pin ceramic QFP
  • radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
  • System-on-a-chip (SoC) including PCI master / slave, 16 GPIO, 3 UART, 3 32-bit timers
  • cache (8KB each for data and instructions)
  • second-sourced by MVC Nizhny Novgorod under the name 1904VE1T () with a clock rate of 40 MHz

1900VM2T

  • development name Rezerv-32
  • 0.35 μm SOI CMOS process
  • 108-pin ceramic QFP
  • radiation tolerance to not less than 200 kRad, working temperature from -60 to 125 °C
  • triple modular redundancy on block level with self-healing
  • both registers and cache (4KB each for data and instructions) are implemented as dual interlocked storage cells (DICE)

1907VM014

  • 0.25 μm SOI CMOS process; manufacturing to be moved to Mikron
  • 256-pin ceramic QFP
  • production planned for 2016 (previously this device was planned to go into production in 2014 under the name 1907VE1T or 1907VM1T)
  • radiation tolerance to not less than 200 kRad
  • SoC including SpaceWire, GOST R 52070-2003 (Russian version of MIL-STD-1553), SPI, 32 GPIO, 2 UART, 3 timers, JTAG
  • cache (8KB each for data and instructions)

1907VM038

  • development name Skhema-10
  • 0.25 μm SOI CMOS process; manufacturing to be moved to Mikron
  • 675-pin ceramic BGA
  • SoC including SpaceWire, GOST R 52070-2003 (MIL-STD-1553), RapidIO, SPI, I²C, 16 GPIO, 2 UART, 3 32-bit timers, JTAG, DSP (same command set as DSP in 1890VM7Ya)
  • DDR2 SDRAM controller with ECC
  • cache (8KB each for data and instructions)
  • working temperature from -60 to 125 °C

1907VM044

  • development name Obrabotka-10
  • 0.25 μm SOI CMOS process; manufactured by Mikron
  • 256-pin ceramic QFP
  • SoC including SpaceWire, GOST R 52070-2003 (MIL-STD-1553), SPI, 32 GPIO, 2 UART, 3 timers, JTAG
  • radiation tolerance to not less than 200 kRad
  • triple modular redundancy in processor core
  • both registers and cache (4KB each for data and instructions) are implemented as dual interlocked storage cells (DICE) with 1 parity bit per byte for cache and Hamming code for registers
  • SECDED for external memory
  • working temperature from -60 to 125 °C

1907VM056

  • development name Skhema-23
  • 0.25 μm SOI CMOS process; manufactured by Mikron
  • 407-pin ceramic PGA
  • SoC including 8-channel SpaceWire, GOST R 52070-2003 (MIL-STD-1553), SPI, I²C, CAN bus, 32 GPIO, 2 UART, 3 timers, JTAG
  • cache (8KB each for data and instructions)

1907VM066

  • development name Obrabotka-26
  • 0.25 μm silicon on insulator (SOI) CMOS process; manufactured by Mikron
  • 407-pin ceramic PGA
  • SoC including 4-channel SpaceWire, GOST R 52070-2003 (MIL-STD-1553), SPI, I²C, RapidIO, GPIO, 2 UART, 3 timers, JTAG, PCI, co-processor for image processing
  • cache (8KB each for data and instructions)

1907VK016

  • development name Obrabotka-29
  • 0.25 μm silicon on insulator (SOI) CMOS process; manufactured by Mikron
  • PGA
  • SoC including 4-channel SpaceWire, GOST R 52070-2003 (MIL-STD-1553), SPI, 32 GPIO, 2 UART, 3 timers, 128KB SRAM
  • triple modular redundancy in processor core

References

|access-date=6 September 2016 | trans-title=VLSI development - Development of microprocessors using the KOMDIV architecture | access-date=6 September 2016 | trans-title=Aspects of the radiation resistance of integrated circuits | archive-url=https://web.archive.org/web/20120425160521/http://cad2011.mephi.ru/downloads/Osipenko_Radiation_2011.pdf | archive-date=25 April 2012 | access-date=7 September 2016 | trans-title=ELECTRONIC COMPONENTS OF SCIENTIFIC RESEARCH INSTITUTE FOR SYSTEM ANALYSIS RAS FOR SPACE APPLICATION | book-title=Scientific experiments on small satellites: apparatus, data collection and control, electronic components | access-date=7 September 2016 | trans-title=Single-chip microprocessor with MIPS architecture 1V812 | archive-url=https://web.archive.org/web/20060721231015/http://www.niisi.ru/o/1b578omp_short.doc | archive-date=21 July 2006 | access-date=7 September 2016 | trans-title=Computer systems development branch | access-date=9 September 2016 | trans-title=1890VM2T | access-date=9 September 2016 | trans-title=Integrated circuit 1907VM038 | access-date=28 March 2017 | trans-title=Integrated circuit 1907VM044 | access-date=3 April 2017 | trans-title=Microprocessors and microcontrollers | archive-url=https://web.archive.org/web/20170310170246/http://mvc-nn.ru/%D0%BF%D1%80%D0%BE%D0%B4%D1%83%D0%BA%D1%86%D0%B8%D1%8F/%D0%BC%D0%B8%D0%BA%D1%80%D0%BE%D0%BF%D1%80%D0%BE%D1%86%D0%B5%D1%81%D1%81%D0%BE%D1%80%D1%8B-%D0%B8-%D0%BC%D0%B8%D0%BA%D1%80%D0%BE%D0%BA%D0%BE%D0%BD%D1%82%D1%80%D0%BE%D0%BB%D0%BB%D0%B5%D1%80%D1%8B | archive-date=10 March 2017 | access-date=29 March 2018 |trans-title = Integrated circuits for computing devices, including microprocessors, microcomputers, digital signal processors, and controllers |archive-url = https://web.archive.org/web/20170328054636/http://promvpk.ru/Catalog/Index/51a26afb6d0fad80e40359fc |archive-date = 28 March 2017 |access-date = 25 October 2017 | trans-title=Method for ensuring the fail-safe operation of FPGA in rocket and space applications | archive-url=https://web.archive.org/web/20170328195239/http://statref.ru/ref_qaspolotryfs.html | archive-date=28 March 2017 | access-date=11 February 2020 | trans-title=Domestic products | access-date=1 September 2016 | article-number=012010 | doi-access=free | access-date=5 April 2017 | trans-title=Russian microelectronics for space applications: Who manufactures what | access-date=8 April 2017 | trans-title=Future computers in the BAGET family | access-date=1 April 2021

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radiation-hardened-microprocessors avionics-computers mips-implementations 32-bit-microprocessors
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