chip-carriers
Articles
- Ball grid arraySurface-mount packaging that uses an array of solder balls
- Land grid arrayType of surface-mount packaging for integrated circuits
- Pin grid arrayType of integrated circuit packaging
- Multi-chip moduleElectronic assembly containing multiple integrated circuits that behaves as a unit
- Solid Logic TechnologyIBM hybrid circuit technology introduced in 1964
- Thin small outline packageThin surface mount IC package
- Pin grid arrayType of integrated circuit packaging
- Ball grid arraySurface-mount packaging that uses an array of solder balls
- Land grid arrayType of surface-mount packaging for integrated circuits
- Embedded wafer level ball grid arrayPackaging technology for integrated circuits
- Ball grid arraySurface-mount packaging that uses an array of solder balls
- Land grid arrayType of surface-mount packaging for integrated circuits
- Multi-leaded power package
- Small outline integrated circuitSurface mount variant of DIP
- Quad flat packageSurface mount integrated circuit package with "gull wing" pins extending from all sides
- Chip carrierSurface mount technology package for integrated circuits
- Pin grid arrayType of integrated circuit packaging
- Through-hole technologyCircuit board manufacturing technique
- Flip chipTechnique that flips a microchip upside down to connect it
- Flat no-leads packageIntegrated circuit package with contacts on all 4 sides, on the underside of the package
- Chip-scale packageIntegrated circuit package that is no or barely larger than the die it contains
- Ball grid arraySurface-mount packaging that uses an array of solder balls
- Land grid arrayType of surface-mount packaging for integrated circuits
- Through-hole technologyCircuit board manufacturing technique
- Pin grid arrayType of integrated circuit packaging
- Ball grid arraySurface-mount packaging that uses an array of solder balls
- Multi-chip moduleElectronic assembly containing multiple integrated circuits that behaves as a unit
- Through-hole technologyCircuit board manufacturing technique
- Land grid arrayType of surface-mount packaging for integrated circuits
- Pin grid arrayType of integrated circuit packaging
- Dual in-line packageType of electronic component package